抽象的な

Electrodeposition Of Copper In Presence Of Carbohydrates

Nabila M.Elmlah*, Farag A.Issa, Abd Elmonum.M.Ahmed, Lamyaa F.Gado

The rate of electrodeposition of copper plates was determined bymeasuring cathodic limiting current in absence and in presence of carbohydrates as(Glucose, fructose, mannose, sucrose, lactose and maltose). It is found that the rate of electrodeposition decreases in presence of organic additives by amount ranged from 1.89% to 35.85% depends on the types of additives and their concentrations. The investigated adsorption isotherm indicates that the inhibition fits to the Langmuir adsorption isotherm and Flory -Huggins adsorption isotherm. It is found that the rate of electrodeposition decreases by increasing height and CuSo4 concentrations. Thermodynamic parameters are given and show that electrodeposition process is diffusion controlled. The rate of deposition and its equations are represented as: Sh=9.784 Re0.5017 Sc0.33 for Glucose with an average deviation: 0.0119%, Sh=9.790 Re0.5017 Sc0.33 for Fructosewith an average deviation: 0.0226%, Sh=9.786 Re0.5017 Sc 033 forMannosewith an average deviation: 0.0621%, Sh=9.790 Re0.5016 Sc0.33 for Sucrose with an average deviation: 0.0234%, Sh=9.790 Re0.5016 Sc0.33 for Lactose with an average deviation: 0.0075%, Sh=9.799 Re0.5016 Sc0.33 forMaltose with an average deviation: 0.0126%