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Electroplating of Metals in Presence of Benzoic acid Derivatives and their Biological Effect

Asmaa H Zayed*, Adel A Nassar, Abdel-Moneim M Ahmed, Mona A Darwish

In this article, copper electroplating in presence of some forms of benzoic acid derivatives was studied. the impact of operational variables, together with organic additives concentrations and temperature on the limiting current were investigated by the potentio-dynamic polarization technique. The adsorption of all inhibitors on copper cathode was found to comply Temkin, Flory-Huggin and kinetic adsorption isotherm. The calculated free energy of adsorption (Δ Gads) of inhibitor on copper surface indicated that the adsorption reactions were spontaneous (Δ Gads<0). The thermodynamic activation parameters (Ea, Δ H*, Δ S* and Δ G*) were also calculated. it had been found that energy of activation values for copper electroplating in inhibited solutions were higher than that for uninhibited solution. The high substance adequacy was discussed in terms of strong adsorption of inhibitor molecules on the copper surface. Also, during this study, biological activities of some synthesized compounds were investigated.