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Structural morphology, electrochemical corrosion behavior, electrical, thermal and mechanical properties of quenched tin- bismuth alloys

Mustafa Kamal, Abu Bakr El- Bediwi, Somaya El-Hindawey

This study investigated structural morphology, electrochemical corrosion behavior, thermal, electrical and mechanical properties of quenched tinbismuth alloys using different experimental techniques. The Bi-Sn phase is appeared after adding 50% Bi in tin- bismuth alloy. Corrosion rate of tinbismuth alloy in different chemical solutions (0.5MHNO3, 0.5MH2SO4, 0.5 M HCl) is increased by increasing the bismuth amounts in it. Elastic modulus and melting point values of tin- bismuth alloy is decreased by increased the bismuth amounts in it but electrical resistivity value is highly increased by increased the bismuth amounts in it. Internal friction and thermal diffusivity values of tin- bismuth alloy are varied with increasing the bismuth amounts in it. Enthalpy, Solidus and Liquidus points are calculated fromDTAthermograph. Our results showthat, SnBi30 is the best solder alloy for electronic industrial application compared to commercial Pb- Sn solder alloy.